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Alloy Design for Cu-based Shape Memory Alloys
发布时间: 2017-09-12
浏览次数: 143

报告题目:Alloy Design for Cu-based Shape Memory Alloys

  

报告人:日本东北大学贝沼亮介教授

  

时间:20179151030开始

  

地点:材料学院新楼308会议室

  

  

报告人简介:

贝沼亮介(Ryosuke KAINUMA),博士,日本东北大学大学院工学研究科教授,主要研究方向为基于实验和计算相图研究材料的微观结构,进而通过对材料的结构控制开发新材料,研究课题包括形状记忆合金,磁性材料,耐热材料,高强度铜合金,低热膨胀合金,热电材料等。已在国际学术期刊发表论文200多篇,其中《Nature1篇,《Science5篇,获得日本金属学会学术成就奖、文部省科学技术奖等各类奖项17项。已成功开发了Co-based超耐热材料(日立有限公司,摩擦搅拌焊接工具),Cu-Al-Mn超弹性合金(古河技术材料:绕线钉修正装置)等新材料并投入实际使用。

  

报告摘要:

The TiNi shape memory alloy (SMA) is one of the important functional metallic materials and widely used in many fields.However, caused by the low ductility, the sample shape applicable to practical use is industrially limited to wire, which restricts widening the practical application field.In 1990’s we have developed a novel Cu-based SMA, Cu-Al-Mn, showing a high ductility and an excellent superelasticity (SE), and recently applied it to medical devise for curing ingrown toenail. Very recently, we are about to widen the use to seismic structure, through a unique grain growth technique.In the presentation, the details of alloy design to obtain ductility and microstructural control to improve SE properties will be presented, together with some examples in applications.

 

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