教授

1. 类器官芯片与疾病微环境模拟

2. 仿生细胞外基质材料

3. 机器学习与生物材料智能设计

研究方向聚焦于类器官工程前沿交叉领域，致力于通过生物材料、微流控技术与机器学习的深度融合，提升类器官芯片的功能成熟度与生理仿生性。核心研究内容涵盖：利用机器学习算法赋能实验设计与材料发现，结合微流控技术构建新型仿生类器官芯片系统，精准模拟器官与组织纤维化等病理微环境，以用于疾病建模与药物筛选。相关学术成果发表于 Science Advances、Advanced Materials、PNAS 等国际权威期刊；与工业界保持积极合作，并与巴斯夫联合申请 PCT 国际专利。曾获诺和诺德博士后研究基金（Novo Nordisk - Oxford Postdoctoral Research Fellowship）资助、国家优秀自费留学生奖学金等荣誉。

欢迎对生物材料、微流控技术、类器官模型或AI for biomaterials感兴趣的本科生、硕士生、博士生及博士后加入团队。可通过电子邮件与我联系。

更多信息请访问个人主页：https://zkchen.org

（1） Chen, Z.,^# Miao, Z.,^# Tom, G., Cheng, A., Gusarova, E., Zondag, B., Wu, T., Kalhori, D., Hinz, B., Abolhasani, M., Aspuru-Guzik, A., Kumacheva, E., 2025. Active Learning-Accelerated Discovery of Fibrous Hydrogels with Tissue-Mimetic Viscoelasticity. Advanced Functional Materials, 2026, e75639.

（2） Chen, Z., Kalhori, D., Rakhshani, F., Baraka, O.E., Qu, L., Kolle, S.N., Andre, V., Deisenroth, T. and Kumacheva, E., 2024. Hydrodynamically generated multilayer skin spheroids enable in vitro screening of biologically active ingredients and toxicity tests. Science Advances, 2025, 11 (19), eadu1251.

（3） Kalhori, D., Rakhshani, F., Ma, Y., Yakavets, I., Kheiri, S., Zeyons, O., Kolle, S., Deisenroth, T., Qu, E., Chen, Z.,^* and Kumacheva, E.,^* 2025. Spheroid-based skin-on-a-chip platform for the evaluation of the toxicity of small molecules and nanoparticles. Lab on a Chip, 2025, 25, 4038-4047.

（4） Chen, Z., Ezzo, M., Zondag, B., Rakhshani, F., Ma, Y., Hinz, B., Kumacheva, E. Intrafibrillar Crosslinking Enables Decoupling of Mechanical Properties and Structure of a Composite Fibrous Hydrogel. Advanced Materials, 2024, 36 (2), 2305964.

（5） Chen, Z., Kheiri, S., Gevorkian, A., Young, E., Andre, V., Deisenroth, T., Kumacheva, E. Microfluidic arrays of dermal spheroids: a screening platform for active ingredients of skincare products. Lab on a Chip, 2021, 21, 3952-3962.

专利发表：

Kumachev, E., Chen, Z., Deisenroth, T., Andre, V.: “Skin spheroids and process of preparation and use thereof”. PCT filed on November 5th, 2021. Publication No.: WO/2022/108772.